Printed Circuit Board (PCB) Design Process and Fabrication

1. FR-4 composite material

		a)	provides the basis for creating the circuit pattern.
		b)	is a core material for PCBs.
		c)	refers to electro-mechanical devices
		d)	is a binder material

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2. Cadence

		a)	is a commercial software tool for PCB design
		b)	is a component of a library
		c)	is a composite used in the fabrication of pcb's
		d)	is the lack of ground planes

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3. Aluminum backed PCBs

		a)	offer a highly thermally conductive dielectric layer
		b)	Are used just in very simple PCB's
		c)	are used in Radio frequency applications
		d)	are used in flexible PCB's

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4. A proper layer stack-up will significantly reduce

		a)	the power consumption
		b)	the number of vias
		c)	the Electro Magnetic Interference
		d)	the internal impedance

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5. The Manhattan length is

		a)	the shortest path that a wire can have when it must be connected using only segments that are confined to either the X axis or Y axis.
		b)	the internal impedance
		c)	the distance to a ground plane
		d)	the distance to the power supply path

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6. The RS-274-D is

		a)	an important step in the fabrication process of PCB's
		b)	a protocol used in the routing
		c)	as a machine-based format for vector photoplotters
		d)	the name of OPAmps in a library

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7. Ground planes

		a)	emit electromagnetic radiation
		b)	are used as nets for critical components
		c)	provide a low-impedance ground connection
		d)	are a common source of crosstalk

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8. The necessary connections between parts with a wire in PCBS are called

		a)	Nets
		b)	HDI's
		c)	Boards
		d)	wires

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9. HDI means

		a)	High decoupling interface
		b)	High Density Interconnect
		c)	High device integration
		d)	High damage induced

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10. A via or VIA

		a)	is an electrical connection between layers in a physical electronic circuit
		b)	improves the life of the PCB
		c)	is used to protect the components included in the PCB
		d)	is applied covering the circuit

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11. PCB design is mainly a two step process:

		a)	Film generation and electrical test
		b)	Film generation and electroless copper deposition
		c)	electronic symbol and footprint
		d)	design of a schematic and lay out of the board based on that schematic

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12. Part libraries of CAD a software link

		a)	schematic symbol and electrical properties of the component
		b)	schematic symbol and footprint of the component
		c)	floor plan and footprint of the component
		d)	software for schematics and software for layout

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13. A netlist file

		a)	is a file that specifies the names of all nets that appear in the schematic
		b)	contains the length and thickness of the traces
		c)	is a file that specifies the connections between the component footprints in the layout process
		d)	contains the X-Y coordinates of the components

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14. Gerber files

		a)	include output files from the schematic
		b)	contains the assemby drawings and instructions
		c)	contains special part references of some components
		d)	include output files from the layout

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15. To reduce trace resistance

		a)	Trace width should be decreased as well
		b)	Trace width should be increased
		c)	Trace length should be as long as possible
		d)	PCB material should be FR-4

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16. Which of the following files is not included in the Gerber files

		a)	component map (X-Y coordinates)
		b)	component footprints
		c)	All metal layers
		d)	Silkscreen top and bottom

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17. DRC stands for

		a)	has no meaning in the PCB design proces
		b)	Drawing Rule Check
		c)	Drill Rule for Circuits
		d)	Design Rule Check

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18. Surface finish

		a)	removes unnecessary copper traces from the substrate
		b)	checks for surface defects of the PCB
		c)	is done using ink jet printing
		d)	provides solderable surface

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19. The solder mask

		a)	indicates where the components must be soldered
		b)	is done using ink jet printing
		c)	provides solderable surface
		d)	covers everything on the PCB board except pads and vias

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20. The electrical test checks the PCB to ensure

		a)	there are no open circuits
		b)	there are no short circuits
		c)	the PCB is free of defects and meet the expected quality standards
		d)	the circuit can work at frequencies above 1 GHz

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