Integration of smart devices into packaging, or better, into the products themselves will allow a significant cost saving and increase the Eco friendliness of products. The use of integration of chips and antennas into non-standard substrates like textiles and paper, and the development of new substrates, conducting paths and bonding materials adequate for harsh environments and for ecologically sound disposal will continue. System-in-Package (SiP) technology allows flexible and 3D integration of different elements such as antennas, sensors, active and passive components into the packaging, improving performance and reducing the tag cost. RFID inlays with a strap coupling structure are used to connect the integrated circuit chip and antenna in order to produce a variety of shapes and sizes of labels, instead of direct mounting.